ulc0404fc3.3c thru ulc0404fc36c 1 05168.r5 4/05 www .protekde vices.com unbumped low capacitance flip chip arra y only one name means protektion? applica tions ? cellular phones ? personal digital assistant (pda) ? notebook computers ? smart cards iec compa tibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns fea tures ? esd protection > 25 kilovolts ? available in voltages ranging from 3.3v to 36v ? 200 watts peak pulse power per line (tp = 8/20s) ? low clamping voltage ? bidirectional configuration & monolithic structure ? protects 1 to 3 lines ? low capacitance ? low leakage current ? rohs compliant mechanical characteristics ? standard eia chip size: 0404 ? weight 0.73 milligrams (approximate) ? solder reflow temperature: tin-lead: 240-245c lead-free: 260-270c ? flammability rating ul 94v-0 ? 8mm plastic & paper tape and reel per eia standard 481 ? device marking on reel u0404 (single chip shown) 05168 pin configura tion
2 www .protekde vices.com 05168.r5 4/05 ulc0404fc3.3c thru ulc0404fc36c device characteristics maximum ratings @ 25c unless otherwise specified operating temperature symbol value -55 c to 150 cc c -55 c to 150 c units t j t stg parameter storage temperature peak pulse power (t p = 8/20s) - see figure 1 p pp 200 watts 0 5 10 15 20 25 30 t - time - s 0 20 40 60 80 100 120 i pp - peak pulse current - % of i pp test waveform parameters t f = 8s t d = 20s t f peak value i pp e -t t d = t i pp /2 figure 2 pulse wave form 0.01 1 10 100 1,000 10,000 t d - pulse duration - s 10 100 1,000 10,000 p pp - peak pulse current - watts figure 1 peak pulse power vs pulse time 200w, 8/20s waveform electrical characteristics per line @ 25c unless otherwise specified pa rt number (see note 1) minimum breakdown voltage @ 1ma v (br) volts maximum clamping voltage (see fig. 2) @ i p = 1a v c volts maximum clamping voltage (see fig. 2) @8/20s v c @ i pp typical capacitance @0v, 1 mhz c pf ulc0404fc3.3c ulc0404fc05c ulc0404fc08c ULC0404FC12C ulc0404fc15c ulc0404fc24c ulc0404fc36c 3.3 5.9 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 11.0 13.2 19.8 25.4 37.2 70.0 12.5v @ 16a 13v @ 15a 18v @ 11a 26.9v @ 7.4a 34.5v @ 5.8a 50.6v @ 4a 80.0v @ 2.5a 70 35 32 30 25 20 18 maximum leakage current (see note 2) @v wm i d a 75* 10** 1 1 1 1 1 rated stand-off voltage v wm volts note 1: all devices are bidirectional. electrical characteristics apply in both directions. note 2: *maximum leakage current < 5a @ 2.8v. **maximum leakage current <500na @ 3.3v.
3 www .protekde vices.com 05168.r5 4/05 ulc0404fc3.3c thru ulc0404fc36c graphs 0 5 10 15 20 v c - clamping voltage - volts 0 4 8 12 14 figure 5 typical clamping voltage vs peak pulse current for ulc0404fc05c 10 6 2 i pp - peak pulse current - amps esd test pulse - 25 kilovolt, 1/30ns (waveshape) figure 4 overshoot & clamping voltage for ulc0404fc05c 5 volts per division -5 5 15 25 35 0 25 50 75 100 125 150 t l - lead temperature - c 20 40 60 80 100 % of rated power peak pulse power 8/20s average power figure 3 power derating curve 0
4 www .protekde vices.com 05168.r5 4/05 ulc0404fc3.3c thru ulc0404fc36c ramp-up ramp-down ramp-up 15 seconds solder time 15-20 seconds ramp-down t s - preheat t smax t smin t l t 25c to peak 30-60 seconds temperature - c t p 155 140 0.275mm round non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening (laser cut, 5% tapered walls) solder paste type pad protective finish tolerance - edge to corner ball solder ball side coplanarity maximum dwell time above liquidous (183c) soldering maximum temperature printed circuit board recommendations parameter value requirements temperature: t p for lead-free (snagcu): 260-265c t p for tin-lead: 240-245c preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. recommended non-solder mask defined pad illustration non-solder mask defined pad 0.275mm dia. solder mask opening 0.325mm dia. solder stencil opening 0.330mm dia. application information
5 www .protekde vices.com 05168.r5 4/05 ulc0404fc3.3c thru ulc0404fc36c package outline & dimensions a b c e f i 0.56 nom 0.86 nom 1.0 0.02 0.15 sq 1.0 0.0254 0.406 nom 0.022 nom 0.034 nom 0.039 0.001 0.006 sq 0.039 0.001 0.016 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). package outline mounting pad la yout - option 1 a c d e f g h i 0.51 0.30 0.46 0.20 0.15 sq 0.71 0.99 0.51 note: 1. preferred: using 0.1mm (0.004?) stencil. 0.020 0.012 0.018 0.008 0.006 sq 0.028 0.039 0.020 pad dimensions dim millimeters inches c solder print 0.010? - 0.012? dia. a h d i solder pads f g e die solder contact solder mask outline & dimensions: rev 3 - 9/04, 06024 e f i side a b c top end metalized die contacts
6 www .protekde vices.com 05168.r5 4/05 ulc0404fc3.3c thru ulc0404fc36c package outline & dimensions protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www .protekde vices .com a f g h i 0.51 0.15 sq 0.71 0.99 0.51 0.020 0.006 sq 0.028 0.039 0.020 dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). 3. preferred: using 0.1mm (0.004?) stencil. mounting pad la yout - option 2 solder print 0.014? - [0.36] dia. a h i solder mask f g die solder contact copper contacts 0.009? [0.23] dia. tape & reel ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia 481. 2. 8mm plastic tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-1 (i.e., ulc0404fc05c-t75-1). 3. 8mm paper tape: 7 inch reels - 10,000 pieces per reel. ordering suffix: -t710-2 (i.e., ulc0404fc05c-t710-2). outline & dimensions: rev 3 - 9/04, 06024 tape & reel orientation note: 1. top view of tape. solder bumps are face down in tape package. dual die - 0404 laser orientation line copyright ? protek devices 2005 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility wit h respect to the selection or specifications of such products.
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